| Order Infomation |
EEV-EX11
COM Express Evaluation Carrier Board
ACC-CF-xx
CompactFlash Card Series (xx = Capacity, Capacity Option: 128, 256, 512 MB, 1, 2, 4, 8 GB)
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| EEV-EX11 |
COM Express Carrier Board for Evaluation
Features
- ATX Form Factor
- Accepts Avalue’s & Other Compatible COM Express CPU Module
- VGA / LVDS / Audio / TV-out Interface
- 1 CF, 2 PCI, 4 PCIe x1, 1 PCIe x16, 4 SATA, 2 COM, 8 USB, 16-bit GPIO
Inquiry
Specifications
System |
| Form Factor |
ATX |
| CPU Module Socket |
2 x 220-pin connectors |
| I/O Chip |
Windbond W83627HG-AW |
| AC97 Codec |
Reltek ALC883, 7.1-CH Audio |
| SSD |
One CompactFlash Type I/II socket |
| Expansion |
2 PCI (PCI Rev. 2.3 compliant), 4 PCIe x1, 1 PCIe x16 |
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I/O |
| MIO |
2 x EIDE, 4 x SATA, 2 x FDD, 1 x LPT, 1 x RS-232, 1 x RS-232/422/485, 1 x K/B, 1 x Mouse |
| IrDA Connector |
5 x 1, pitch 2.54 mm header |
| USB Connector |
Two double deck USB connector support 4 USB ports and two 5 x 2 headers onboard support additional 4 USB |
| DIO |
24-bit GPIO, including 8-bit GPIO from COM Express module |
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Connectors |
| External Connector |
2 PS/2 for KB/MS, dual double deck USB, RJ-45, LPT (DB-25), COM 1 (DB-9), LAN (RJ-45), VGA (DB-15) & Mic in, Line in, Line out audio jacks |
| LVDS Connector |
One HIROSE DF13-40DP-1.25V |
| TV-out Connector |
3 x 2, pitch 2.54 mm header x 1 |
| Audio Connector |
7.1-CH Audio connector (Front, Line in, Mic in, Center/Subwoofer, Surround, Rear Surround) |
| Power Connector |
ATX connector |
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Mechanical & Environmental |
| Power Type |
ATX |
| Operating Temperature |
0 ~ 60°C (32 ~ 140°F) |
| Storage Temperature |
-20 ~ 80°C (-4 ~ 176°F) |
| Operating Humidity |
0%~90% relative humidity, non-condensing |
| Size (L x W) |
12" x 7.9" (305 mm x 240 mm) |
| Weight |
1.10 lbs (0.5 k) |
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| * Product specifications are subject to change without notice. Last update: 06/15/2010
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